High-efficiency Direct Deposition Technology

Scintillatech makes it possible that multiple substrates with multiple specifications can be processed by scintillator deposition equipment at the same time. Each scintillator deposition equipment can complete at least 4 pieces (e.g. 43cm*43cm A-TFT) within one single deposition operation.

At present, Scintillatech has possessed 2 scintillator deposition facilities, which can provide customer with sufficient production capacity.

High-efficiency Encapsulation Technology

Scintillatech can encapsulate multiple size plate within one single encapsulation operation. At present, encapsulation equipment can support the maximum size is 108cm*43cm.

High-reliable Imaging Analysis Technology

Scintillatech mastered Imaging analysis with the help of Panel Test Equipment, which ensure product with the high image quality.